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Spherical Boron Nitride

Product Description:

Spherical BN has thermal isotropic properties due to its special particle structure, which overcomes the disadvantages of thermal anisotropy of sheet BN, and achieves good planar thermal conductivity at a low filling ratio. It has the advantages of low density of BN and low dielectric constant. At the same filling amount, the spherical BN has a thermal conductivity more than three times that of the sheet BN. GBNL series products have lower density than GBN, and have high viscosity in the system, high heat conductivity in the case of the same filling amount. However, it is not easy to achieve high filling. It is recommended to use it with the GBN series.

Product Details Product Specifications Download

Product Features:

1. High thermal conductivity
2. Low S.S.A.
3. High filling ability (For low shear machining applications) 
4. Thermal isotropic
5. The particle size is uniform, and the distribution is very narrow, conducive to achieve a stable match with other fillers in the application


Critical Applications:

1. Electronics Packaging
2. High Frequency Power Devices
3. Solid State LED Lighting
4. Thermal interface materials: thermal pads, thermal grease, thermal conductivity of the phase change material
5. Thermal conductivity Alumina-based CCL, printed circuit board
6. Thermal engineering plastics





* Remark: The characteristic values recorded in the table are typical for reference not the highest specification unless specified. Please contact Bestry sales representatives for specifications when you encounter any question.

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