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Heat Dissipation Design of Thin and Small Electronic Products and Application of Soft

    With the rapid development of microelectronics technology, the chip size is shrinking and smaller, and the computational speed is increasing, which induces larger calorific value, for example, produced 3.6g the heat reaches up to 115W when Intel processors Pentium 4 ultimate edition run, which requires the heat dissipation of the chip proposed higher. Designers must adopt advanced cooling technology and excellent heat sink performance material to effectively remove heat and ensure that the chip can withstand maximum normal operation temperature. Electronic equipment and terminal appearance meets higher requirements to the thin small development, TV from CRT to flat-panel LCD TV, desktop to notebook computer, and digital set-top boxes, and portable CD players. The thermal design is different from traditional form because of the product’s smaller size.
     Temperature is the most important factor affecting the reliability of electronic equipment. Statistics show that the reliability of electronic components falls by 10% with a 2 degree increase of temperature. This suggests measures need to be taken to limit rising temperatures of chassis and components, which is the concept of thermal design. Thermal design principles: First, reducing heat is to select better control methods and techniques, such as phase shifting control technology or synchronous rectification technology. Reducing the number of heating devices, increasing crude printed line width and improving the power efficiency are also the choices of low power devices. Second, increase heat dissipation, such as the use of the conduction, radiation and convection technologies, or heat transfer. But the appearance of flat products cannot use more heat radiating aluminum sheet and fans, which doesn't allow to strengthen the cooling type radiating design that cannot be used on the manifold. The same radiation heat dissipation in flat space is difficult. So everyone thought that the use of casing cooling, the benefits are not to consider the fan and fan power, not for that fans cause more dust or noise.
     How to make good use of the machine shell to dissipate heat? Opportunities for application of soft silicone heat conductive insulating materials are available. Flexible heat conducting silicone insulation pad is a kind of thermal interface material, sheet material. According to the heating power device the size and shape of arbitrary cutting and thermal conductivity and insulation characteristics, its role is to fill in the gap between the heating power device and the radiator is an alternative heat-conducting silicone grease thermal paste with mica (insulating materials) binary cooling system. The product's thermal conductivity is 2.45 W/m·K and the coefficient of thermal conductivity of air is 0.03 W/m·K. The anti-breakdown voltage value is more than 4000 volts. Most electronic equipment with insulation requirements can be used. Process thickness ranges from 0.5mm to 5mm. Each 0.5mm increase one time, namely 0.5mm, 1mm, 1.5mm and 2mm, lastly to 5mm. Special requirements can be increased by 10mm, and different thicknesses makes it easy for designers to select products of different thickness according to the magnitude of the gap between the heating and cooling facilities, which can achieve the best filling effect. Fire retardant performance accord with the requirements of the updated Lagrangian 94V-0 and the EU SGS environmental protection certification, whose working temperature is general at 50 to 220℃. Therefore, it is a very good thermal conductivity material. With its special soft, it’s specifically used for heat transfer in gap production design schemes and its ability to fill the gap, heating part and radiating part of heat transfer and increases the heat transfer area, as well as shocks insulating sealing, etc. It is a very important technology to meet agency equipment miniaturization and ultra-thin design requirements. It’s suitable for a wide thickness range, which is particularly applicable to automotive, computer and electronics industries.

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